Photonic Integration and Packaging of PICs, laser diodes, SLDs and SOAs
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Request a quoteTeraXion has more than a decade of experience in the design, integration, characterization and mass production of custom photonic modules for a broad range of applications. We routinely package an extensive range of photonic components, such as semiconductor laser diodes, PICs, SOAs, photodiodes, filters, and modulators within a single fiber coupled package to create custom optical engines for our customers. Industry standard butterfly packages can be used as well as custom packages and enclosures. We can also integrate high performance laser control electronics for frequency and phase locking.
TeraXion’s state-of-the-art hybrid packaging allows us to co-develop robust, cost-optimized, ultra-compact integrated photonics solutions for our customers.
“Why PIC TeraXion” as your development partner?
- World Class photonic integration capabilities offering precise alignment of DFB laser diodes, SOAs, PICs, FBGs and optical fiber
- >10 years experience in chip design and dozens of silicon photonic (SiP) and InP wafer runs
- High throughput test and burn in stations for volume production
- Experts in low noise laser drive and control electronics
- Telcordia proven robust packaging with high coupling efficiency and best-in-class thermal management
- An agile, innovative approach from proof-of-concept to volume production
Applications
- Automotive and wind LIDAR
- Fiber Optic Gyroscopes
- Quantum Comms & Processors
- Medical & Ophthalmic
Multi-wavelength RFOG, with 3 phase-locked narrow linewidth DFB laser diodes, SiP chip for light mixing, phase control and master-slave locking interactions, FBG frequency discriminator, piezo-electric modulators, isolator and coupling optics.
FMCW lidar multi-channel coherent detection engine – Co-packaging of intrinsically narrow linewidth DFB laser diodes, semi-conductor optical amplifiers (SOAs), SiP chip for light mixing and detection, circulators, isolator and coupling optics.
Top 4 Features
High Performance Photonics and Electronics
High power & narrow linewidth DFB laser diodes, high power SOAs, elaborated PIC, low noise drive electronics, etc.
Ultra-Compact and Stable
Compact packaging with high coupling efficiency and best-in-class thermal management.
Agility and Innovation
Customer driven approach, extensive support from the proof-of-concept ideation up to the transfer into production.
Scalability
Our vision is to optimize system cost by saving on packaging (functions gathering) and getting rid of external modulators.